发明名称 Pre-treatment method performed on a semiconductor structure before forming hemi-spherical grains of capacitor storage node
摘要 A pre-treatment method for improving the growth of hemi-spherical grains (HSGs) on a semiconductor structure by removing etching residue before forming a capacitor storage node having the HSGs. The pre-treatment method includes dry-etching a material layer formed on a surface of a semiconductor substrate to form a storage node pattern on the semiconductor substrate. Multiple ashing sequences are then performed on the semiconductor structure using an etching gas, followed by a stripping step using H2SO4 to remove any residue remaining on the semiconductor structure after the multiple ashing sequences. The semiconductor structure is then cleaned with an ammonium peroxide mixture (APM), and HSGs are thereafter grown on capacitor storage nodes of the storage node pattern.
申请公布号 US6228739(B1) 申请公布日期 2001.05.08
申请号 US19990306917 申请日期 1999.05.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HA HEON-JAE;SON HONG-SEONG;HONG YOUNG-KI;SONG JAE-INH;PARK CHUN-YONG
分类号 H01L21/8232;H01L21/02;H01L21/306;H01L21/311;H01L21/3213;(IPC1-7):H01L21/20 主分类号 H01L21/8232
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