| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polisher which can reduce the processing costs in a polishing process, and which can eliminate the necessity of a slurry circulating system. SOLUTION: A wafer 6 held in a wafer carrier 1 is polished by a polishing pad on rotation. Slurry is fed onto the polishing pad 3 from a slurry supply nozzle 2. Filter 5 which is provided upstream of the wafer 6 as viewed in the rotating direction of the polishing pad 3, is adapted to capture chips produced on the polishing pad 3. A protecting disc 4 is provided so as to surround the polishing pad 3, and is adapted to prevent the slurry from discharging outside during polishing, in order to retain the slurry on the polishing pad thereby making it possible to repeatedly use the slurry.</p> |
