发明名称 |
Adhesive tape for electronic parts |
摘要 |
This invention provide an adhesive tape for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises a metal substrate, an adhesive layer A and an adhesive layer B laminated in order, wherein said adhesive layers A and B are resin layers composed of 100-40% by mol of at least a polyimide comprising the repeating unit represented by the formula (1) and 0-60% by mol of the repeating unit represented by the formula (2), said two adhesive layers having each a different glass transition temperature:wherein X is -SO2- and/or -C(=O)-OCH2CH2O-C(=O)-, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or -CH2OC6H4-, and n means an integer of 1 to 20.
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申请公布号 |
US6228452(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US19980015334 |
申请日期 |
1998.01.29 |
申请人 |
TOMOEGAWA PAPER CO., LTD. |
发明人 |
OKA OSAMU;NISHIGAYA TAKESHI;TOCHIHIRA JUN;KOMAGATA FUMIKI |
分类号 |
C08G73/10;C09J7/02;C09J179/08;H01L21/52;H01L21/60;H01L23/29;H01L23/31;(IPC1-7):C09J7/02 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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