发明名称 Polishing pad reconditioning via polishing pad material as conditioner
摘要 A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.
申请公布号 US6227948(B1) 申请公布日期 2001.05.08
申请号 US20000532170 申请日期 2000.03.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 KHOURY RAYMOND M.;MERKLING, JR. ROBERT M.;OCASIO JOSE M.;ZIEMINS ULDIS A.
分类号 B24B37/04;B24B53/007;B24D9/08;(IPC1-7):B24B1/00 主分类号 B24B37/04
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