发明名称 |
Polishing pad reconditioning via polishing pad material as conditioner |
摘要 |
A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.
|
申请公布号 |
US6227948(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US20000532170 |
申请日期 |
2000.03.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KHOURY RAYMOND M.;MERKLING, JR. ROBERT M.;OCASIO JOSE M.;ZIEMINS ULDIS A. |
分类号 |
B24B37/04;B24B53/007;B24D9/08;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|