| 摘要 |
PROBLEM TO BE SOLVED: To provide a favorable epoxy resin composition as a sealing material of a semiconductor device. SOLUTION: A subject composition comprises compounding an epoxidized polybutadien containing an alkoxysilyl group, having a number average molecular weight of 500-10,000, and represented by the following general formula into an epoxy resin composition consisting of an epoxy resin, a curing agent and an inorganic filler.
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