High density leaded ball-grid array package

摘要

A high density leaded ball-grid array package for packaging an integrated-circuit die includes a laminated substrate formed of a non-conductive layer sandwiched between first and second conductive trace patterns. A leadframe is directly attached onto the first conductive trace pattern of the laminated substrate by a non-conductive adhesive so that the open portion thereof overlies a central region of the laminated substrate. An integrated-circuit die is mounted in the central region of the laminated substrate. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and bonding fingers formed on the leadframe. A plastic material is molded over the top surface of the die, bonding fingers and bonding wires. A solder mask is applied on the second conductive trace pattern so as to form selective solderable areas. Finally, solder balls are attached to the selective solderable areas.