INTERCONNECTION LAYOUT STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: An interconnection layout structure of a semiconductor device is provided to prevent a process defect generated after an interconnection layer is formed, by changing the layout structure of the interconnection layer to increase an interval between the interconnection layers without an additional process. CONSTITUTION: An interconnection layout structure of a semiconductor device has a plurality of interconnection layers which are adjacent to each other. At least one convexo-concave part(102) is designed in a portion on a plane of the interconnection layer. The line width of the interconnection layer is changed by the convexo-concave part.