CHEMICAL AND MECHANICAL POLISHING SLURRY

摘要

PURPOSE: Provided is a chemical and mechanical polishing slurry, which prevents erosion phenomenon by controlling the amount of an abrasive so as to remove selective ratio to metal layers. CONSTITUTION: The chemical and mechanical polishing slurry is characterized by containing i) aqueous medium; ii) 1-1.5wt% of one abrasive selected from silica, alumina and ceria; iii) 0.01-10wt% of a catalyst oxidizer such as potassium peri cyanide; and iv) 0.01-10wt% of one main oxidizer selected from benzoyl peroxide, calcium peroxide, barium peroxide and sodium peroxide.