| 摘要 |
PURPOSE: A method for exposing a semiconductor device is provided to improve the reliability and the characteristic of a semiconductor device by performing an alignment process once. CONSTITUTION: A predetermined pattern is formed on an exposure mask(21,23) formed with an alignment mark(24,29). The exposure mask(21,23) is located on an upper portion of a wafer(27) by using wafer alignment equipment. The wafer(27) is aligned and fed back. The exposure mask(21,23) and the wafer(27) are aligned once. An exposing portion of the exposure mask(21,23) and an exposing portion of the wafer(27) are exposed, respectively. The alignment process is performed in a static state when a stepper is used as the exposure equipment.
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