Semiconductor chip manufacturing method has contact elements for connecting chip to external electrical components provided before separation of chip from semiconductor wafer

摘要

The manufacturing method has semiconductor chips (15) provided with contact elements (18) for connection with external electrical components before the chips are separated out from the semiconductor wafer (17), by application of a metallised plastic or metallic foil. Also included are Independent claims for the following: (a) a method for manufacturing carrier bands for reception of semiconductor chips; (b) a contactless chip card manufacturing method