ELECTRIC MODULE STRUCTURE FORMED WITH A POLYMER SHRUNK MATERIAL

摘要

A microelectric module including a circuit substrate having one or more covers or electromagnetic shields disposed thereon. To secure the covers or electromagnetic shields to the circuit substrate, and provide an electrical contact with an underlying ground pattern, a thin plastic film is extended over the covers or electromagnetic shields and the circuit substrate. This film is subjected to heat, causing it to shrink and effectively provide a controlled force that acts to hold and lock the covers or electromagnetic shields to the circuit substrate. Thus the heat-shrunk film mechanically secures the covers or electromagnetic shields to the circuit substrate and at the same time seals the microelectric module formed.