Sealed-by-resin type semiconductor device and liquid crystal display module including the same

摘要

A sealed-by-resin type semiconductor device includes a substrate, a lead provided on the substrate, and a semiconductor element provided on the lead by flip chip bonding. The semiconductor element includes a plurality of terminals connected to the lead. The sealed-by-resin type semiconductor device further includes a resin for protecting the plurality of terminals, and the resin has a sufficiently low elasticity modulus that occurrence of undesirable migration is suppressed. <IMAGE>