发明名称 Mounting structure of a semiconductor device module for a computer system
摘要 A mounting structure for mounting a semiconductor device module in a computer system, comprises a housing for mounting a motherboard having peripheral ports for connecting with various peripheral devices, an opening formed in the housing for allowing the semiconductor device module to be mounted on or detached from the motherboard, a plurality of fasteners positioned between the motherboard and semiconductor device module for fixing the semiconductor device module on the motherboard, each of the fasteners having two end parts being respectively connected with the motherboard and semiconductor device module, and a rear bracket attached to one side of the housing for supporting the peripheral ports and additionally serving as an electromagnetic interference preventer, wherein the rear bracket fuirther includes an extension plate placed beneath the motherboard to face the part ofthe motherboard mounted with the semiconductor device module, and a plurality of bosses formed on the extension plate so as to respectively hold the end parts of the fasteners connected with the motherboard.
申请公布号 US6226179(B1) 申请公布日期 2001.05.01
申请号 US19990419298 申请日期 1999.10.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SUNG-BAE
分类号 H05K7/14;(IPC1-7):H05K7/20 主分类号 H05K7/14
代理机构 代理人
主权项
地址