发明名称 |
Ball grid array to prevent shorting between a power supply and ground terminal |
摘要 |
A semiconductor device manufactured as a ball grid array, chip scale package, or other surface mounting package wherein shorting between a power supply terminal and a ground terminal can be prevented. At least one solder ball functioning as a signal electrode is disposed between a solder ball functioning as a power supply electrode and a solder ball functioning as a ground electrode on the mounting surface of the package.
|
申请公布号 |
US6225702(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US19980018342 |
申请日期 |
1998.02.04 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NAKAMURA HISASHI |
分类号 |
H01L23/12;H01L21/60;H01L23/498;H01L23/50;H05K1/02;H05K3/34;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|