| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in resolution, tent reliability and edge fusibility and to produce a photosensitive resin laminated body using the composition and a printed circuit board using the laminated body. SOLUTION: The printed circuit board is produced by using the photosensitive resin laminated body having a photosensitive resin composition layer containing (i) an alkali-soluble high molecular compound, (ii) a specified urethane compound, (iii) a photopolymerizable monomer having three or more ethylenically unsaturated groups in one molecule and (iv) a photopolymerization initiator. |
