| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for build-up wiring board, and a production method of printed wiring board, in which fine pattern wiring is facilitated while utilizing the conventional characteristics and abnormal deposition of electroless nickel plating and electroless gold plating is eliminated. SOLUTION: On the surface of a metal foil, a first resin layer containing no filler is provided under the state of stage C or B and a second resin layer containing a filler is provided thereon in stage B or A to produce a material for build-up wiring board. The second resin layer of the build-up wiring board is placed directly on the surface of an inner layer board and hot pressed integrally. Subsequently, a metal foil is removed and a part for connecting an inner layer circuit electrically with a circuit formed on the surface of the first resin layer is irradiated with laser thus making a non-through hole reaching the inner layer circuit. Thereafter, a plating metal layer is formed on the surface of the first resin layer and the inner wall of the non-through hole, an etching resist layer is formed on the surface of the plating metal layer and then the unnecessary plating metal layer is removed by etching. |
