| 摘要 |
PROBLEM TO BE SOLVED: To make repairing work, such as the components exchange work, etc., to be carried out efficiently by making substrates capable of being removed one by one. SOLUTION: A semiconductor device 1 is constituted by laminating a plurality of mounting substrates 2A, 2B, and 2C which carry electrodes 4A, 4B, 5B, and 5C for connection on one or both surfaces and mounted with electronic components 10, such as the semiconductor chip 11, etc., upon another with intermediate substrates 6D and 6E for carrying electrodes 7D, 7E, 8D, and 8E for connection on both surfaces in-between. The electrodes for connection of the substrate are connected to each other, by using connecting materials 9A, 9B, 9C, 9D, and 9E having different melting points, electrical conductivities, and hot-melting properties.
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