发明名称 TERMINAL UNIT STRUCTURE OF HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide the terminal unit structure of a heat sink, which is easily assemble to a heat sink and by which a manufacturing process is quickened, and cost can be reduced. SOLUTION: This terminal unit of the heat sink has an integrally molded board 31 in which a plurality of terminals 311 are molded integrally, and the integrally molded board 31 is installed to the heat sink and a plurality of the terminals 311 are connected electrically to the heat sink in the terminal unit structure of the heat sink.
申请公布号 JP2001119168(A) 申请公布日期 2001.04.27
申请号 JP19990276524 申请日期 1999.09.29
申请人 TAIDA ELECTRONIC IND CO LTD 发明人 SE EIHYO;YU SHUTOKU
分类号 H05K7/14;(IPC1-7):H05K7/14 主分类号 H05K7/14
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