| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a semiconductor element mounted by a TAB system from being broken by thermal stress due to contact of the element with a packaging board, when a semiconductor device itself is mounted on the packaging board along with a heat sink. SOLUTION: An elastic insulating resin 7 is provided on the surface region of a semiconductor element 5. Accordingly, even if impact is applied to the surface of the element 5 when a semiconductor device itself is mounted on a packaging board turning the surface of the element 5 to the side of the packaging board, the impact is absorbed by the resin 7, can be relaxed and reliability can be obtained. In particular, in the case where the device itself is mounted on the packaging board turning the surface of the element 5 to the side of the packaging board and a heat sink is provided on the side of the bottom of the device, the device causes deflection, the surface of the element 5 abuts on the packaging board and the impact can be applied to the surface of the element 5, but the impact can be absorbed by the resin 7, relaxed, and reliability can be obtained.</p> |
