| 摘要 |
PROBLEM TO BE SOLVED: To realize an easy switching of kind in a sealing process as well as a high throughput. SOLUTION: A carrier tape 60 on which a semiconductor pellet 63 is mounted is spanned between a delivery reel 51 and a take-up reel 52 so that it passes between an upper mold 10 and a lower mold 20 as well as a gate brake presser 31 provided behind them and a gate brake stage 30. It is moved in synchronous with clamping and mold-releasing between the upper mold 10 and lower mold 20, so that a series of molding operations such as resin-sealing of a semiconductor pellet 63 with a cavity 22a between the upper mold 10 and the lower mold 20 and gate brake thereafter, etc., are continuously performed. A plurality of mold modules each of which has the above configuration are operated in parallel under a master module.
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