发明名称 WIRE-BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wire-bonding device of a structure, where the free vibrations of a cantilever-shaped elastic body are absorbed and a decision on the absorption effect of the free vibrations can also be made. SOLUTION: A wire-bonding device is provided with a unit to press or absorb the surface, which is separated from bonding points 6, 7 and 8 on the upper surface of a cantilever-shaped elastic body 1, of the elastic body 1 via vibration absorber 2 and the decision on the absorption effect of the free vibrations of the elastic body 1 is made by electrical characteristics 15 and 16, which are shown by a vibrator for ultrasonic bonding.</p>
申请公布号 JP2001118879(A) 申请公布日期 2001.04.27
申请号 JP19990330356 申请日期 1999.10.15
申请人 ULTRASONIC ENGINEERING CO LTD 发明人 NISHINO SHIGERU
分类号 H01L21/60;F16F15/02;(IPC1-7):H01L21/60 主分类号 H01L21/60
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