| 摘要 |
PROBLEM TO BE SOLVED: To enable the inspections of the electrical characteristics of a plurality of semiconductor devices with electrical pads arranged on their peripheral parts only at the same time in batch, whereby yield of the manufacture of the devices is raised, manufacturing cost of the devices is reduced and a semiconductor inspection device is realized, which is low in cost and has high reliability. SOLUTION: An inspection wafer 11 has a plurality of inspection regions 17 and one region 17 of the regions 17 corresponding to one material to be inspected. A plurality of electrode pads are arranged on the peripheral part of the material to be inspected. A plurality of probes 13 arranged in the one region 17 are arranged at positions corresponding to the positions of the electrode pads on the material to be inspected, a plurality of in-board beams 12 are formed on the peripheral part of the one region 17, and the probes 13 are respectively formed on the beams 12. Secondary side electrode pads 16 are located respectively within each region 17 and are respectively formed on the side of the inner periphery of each probe 13. Accordingly, the probe 13 within the one region 17 being connected with the pad 16 within the region 17 and the probe 13 being connected with the pads 16 within the other regions 17 are precluded.
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