INTEGRATED PACKAGING OF MICROMECHANICAL SENSORS AND ASSOCIATED CONTROL CIRCUITS

摘要

A micromechanical sensor (42) is fabricated on a first semiconductor wafer (40), and a control circuit is fabricated on a front side of a second wafer (30). A cavity (36) is formed on the backside of the second wafer, the cavity is being formed such that the sensor on the wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes (34) are etched through the backside of the second wafer to allow access to electrical points and a patterned layer (38) is deposited to form electrical interconnections between electrical contact points and terminal points on the backside of the wafer via through-holes. The two wafers are cleaned and bonded together. The bonded wafers are diced to yield individual bonded sensor-control circuit pairs.