| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition that is excellent in moldability and, in spite of containing no halogen-containing flame retardant or antimony compound, can give a cured product being excellent in flame retardancy, having low hygroscopicity, and being excellent in mechanical strengths, heat resistance, solder reflow, etc., and is therefore suited for e.g. sealing electronic components. SOLUTION: This composition contains an epoxy resin and a curing agent and further contains 1-100 pts.wt. per 100 pts.wt. epoxy resin, polycyclic aromatic substance, such as a polycyclic aromatic compound, a pitch, or an aromatic resin, having a softening point of 10-250 deg.C, a carbon residue rate of at least 10 wt.% (as measured by heating to 700 deg.C in a nitrogen stream), and a fraction of aromatics (fa) of at least 0.85 in a 13C-nuclear magnetic resonance spectrum.
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