发明名称 |
Process for plating metal coating |
摘要 |
A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.
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申请公布号 |
US6221440(B1) |
申请公布日期 |
2001.04.24 |
申请号 |
US19970817337 |
申请日期 |
1997.04.02 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
MEYER HEINRICH;SCHULZ RALF |
分类号 |
C23C18/31;C23C16/18;C23C18/30;C23C18/32;H01L21/288;H05K3/24;H05K3/38;(IPC1-7):H05H1/00 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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