发明名称 Process for plating metal coating
摘要 A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.
申请公布号 US6221440(B1) 申请公布日期 2001.04.24
申请号 US19970817337 申请日期 1997.04.02
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 MEYER HEINRICH;SCHULZ RALF
分类号 C23C18/31;C23C16/18;C23C18/30;C23C18/32;H01L21/288;H05K3/24;H05K3/38;(IPC1-7):H05H1/00 主分类号 C23C18/31
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