Chip assembly with load-bearing lid in thermal contact with the chip

摘要

In a direct lid attach structure incorporating thermally conductive material between a lid and an electronic circuit chip, there are provided a number of apertures in the lid. These apertures are provided directly opposite disks or pads disposed on the substrate to which the chip is attached. A hardenable adhesive such as an epoxy is disposed through the apertures and hardened in place so as to provide a bond between the lid and the underlying pad which has been previously affixed to the substrate to which the chip is attached with a compliant adhesive. There is thus provided an electronic chip assembly which allows bonded chip-to-lid thermal interfaces to be used with LGA interconnection techniques. The support structure mitigates the mechanical loads associated with LGA socketing which could otherwise damage the substrate and affect the integrity of the bonded thermal interface.