| 摘要 |
A semiconductor device with wires mounted thereon, each one of the wires, which connects a first bonding point and a second bonding point which are positioned substantially in a lateral relationship, including: a neck height part which extends more or less vertically upward from the first bonding point, a first lateral wire part which extends laterally while dipping downward from the neck height part, a second lateral wire part which extends more or less horizontally from the first lateral wire part, a third lateral wire part which extends while rising from the second lateral wire part, and an inclined part which extends from the third lateral wire part to the second bonding point. Kinks are formed at portions connecting the neck height part, first lateral wire part, second lateral wire part, third lateral wire part and inclined part
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