发明名称 A novel plug structure and process for forming stacked contacts and metal contacts on static random access memory having thin film transistors
摘要 A method for fabricating a novel plug structure for low resistance ohmic stacked contacts and at the same time forming metal contacts to devices on a SRAM cell was achieved. The method involved forming electrically conductive plugs in the stacked contact openings to form ohmic connections between a P+ doped polysilicon layer and a N+ doped polysilicon layer and thereby increasing the on current (Ion) of the SRAM cell. The electrical conductive plugs are also simultaneously formed in metal contact openings to devices areas elsewhere on the substrate. The process for the plug structure also reduces the mask set by one masking level over the prior art process.
申请公布号 US6222214(B1) 申请公布日期 2001.04.24
申请号 US19960630111 申请日期 1996.04.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 WUU SHOU-GWO;LIANG MONG-SONG;SU CHUNG-HUI;WANG CHEN-JONG
分类号 H01L21/768;H01L21/8244;H01L27/11;(IPC1-7):H01L27/108 主分类号 H01L21/768
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