Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board

摘要

A photosensitive resin composition comprising (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group per molecule, and (C1) a photo-acid generator; a photosensitive resin composition comprising (A) a binder polymer, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group per molecule, and (C1) a photo-acid generator; and a photosensitive resin composition comprising (A) a binder polymer, (B1) a photopolymerizable compound having at least one polymerizable cyclic ether group per molecule, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group per molecule, and (C2) a free-radical polymerization initiator.