| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the method of manufacturing a high-density multilayer printed interconnection board which has excellent heat radiation properties and hole connection reliability. SOLUTION: Pads, to which the bumps of a flip-chip, are formed on the surface layer of a multilayer printed interconnection board on which the flip-chip is mounted. The pads are connected to the circuits of respective layers with through-hole conductors with hole diameters of 25-300μm. The inner layer circuits spread from the center parts into the surroundings of the printed interconnection board. The inner circuits are connected to solder ball pads, at least on the surface via the through-hole conductors. With this constitution, a method of manufacturing a high density multilayer printed interconnection board which has superior heat radiation properties and hole connection reliability and the high-density through-holes can be provided. Furthermore, by employing multifunctional ester cyanate resin composition as thermosetting resin, a high- density multilayer printed interconnection board which has superior heat-resistant properties, electrical insulating properties after a pressure cooker treatment, migration-resistant properties, etc., can be manufactured.</p> |
