| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device where a semiconductor substrate is stuck to a mounting member via a middle metal plate. SOLUTION: A semiconductor substrate, a middle metal plate, and a mounting member are stuck by a brazing material that is made of Sn and at least one type of substance selected from a group of Sn, Ag, Cu, Ni, P, Bi, Zn, Au, and In, and a thermal coefficient of expansion in a direction in parallel with the sticking surface of the middle metal plate and thermal conductivity are adjusted to 7-13.5 ppm/ deg.C and 150 W/m.K or higher, respectively, thus improving reliability for joining the semiconductor substrate to the placement member without losing a cooling property. |
