| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a small package element and requires no lead frame while excellent in heat dissipation. SOLUTION: A die attaching region 22 is placed on the upper surface of a conductive sheet 20 excellent in thermal and electric conductivity while a die contact point 24 and a lead contact point 26 are plated on its lower surface. A copper 29, and nickel/palladium connection layers 31 and 33 are plated on the upper surface opposite to the lead contact point 26, forming a mold lock 34. A semiconductor die 40 is fitted to the die attaching region 22 according to its characteristics by solder, conductive epoxy, etc., while connected to the mold lock 34 with a wire bonding 42. The entire upper surface is packaged with a resin housing and then cut and separated into each element. |
