发明名称 |
BGA COMPONENT MOUNTING TERMINAL, BGA COMPONENT MOUNTING STRUCTURE AND METHOD FOR MOUNTING BGA COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To solve the problems in prior art where in mounting a BGA component on a wiring board, the mounting deviation of the connection terminal occurred at the position of a mounting pad of the wiring board because of the spherical connection terminals of the BGA component. SOLUTION: A BGA component mounting terminal 1 is made of a conductive material and formed like a bell jar which has a head 1a dish-shaped for mounting a connection terminal of the BGA component and a leg 1b with a through- hole 1c piercing the leg 1b.
|
申请公布号 |
JP2001111205(A) |
申请公布日期 |
2001.04.20 |
申请号 |
JP19990282313 |
申请日期 |
1999.10.04 |
申请人 |
OKI ELECTRIC IND CO LTD |
发明人 |
UCHIDA KIYOSHI |
分类号 |
H01R4/02;H01L23/12;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H01R4/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|