发明名称 BGA COMPONENT MOUNTING TERMINAL, BGA COMPONENT MOUNTING STRUCTURE AND METHOD FOR MOUNTING BGA COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve the problems in prior art where in mounting a BGA component on a wiring board, the mounting deviation of the connection terminal occurred at the position of a mounting pad of the wiring board because of the spherical connection terminals of the BGA component. SOLUTION: A BGA component mounting terminal 1 is made of a conductive material and formed like a bell jar which has a head 1a dish-shaped for mounting a connection terminal of the BGA component and a leg 1b with a through- hole 1c piercing the leg 1b.
申请公布号 JP2001111205(A) 申请公布日期 2001.04.20
申请号 JP19990282313 申请日期 1999.10.04
申请人 OKI ELECTRIC IND CO LTD 发明人 UCHIDA KIYOSHI
分类号 H01R4/02;H01L23/12;H05K3/34;(IPC1-7):H05K3/34 主分类号 H01R4/02
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