| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of sealing up a ceramic package of a semiconductor, etc., by using a cheap power source and an equipment, without requiring seal frame for the package. SOLUTION: Parallel gap roller electrodes with tapered tips which are expanded confronting each other are horizontally moved as pressed against an outer seal part, and an electric power is intermittently or continuously applied between the roller electrodes.
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