| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame where the outermost plating layer formed on the surface of a metal substrate in a pre-plated frame is improved, and a method for manufacturing the lead frame. SOLUTION: A protection layer is formed on the upper surface of a metal substrate using Ni or an Ni alloy, a middle layer made of Pd or a Pd alloy is formed on the upper surface of the protection layer, Pd and Au are alternately plated to the upper surface of the middle layer for forming a mixed layer where the Pd particle and a gold particle coexist as the outermost layer, thus forming a lead frame and hence obtaining a lead frame where a wire bonding property, solderability, and an adhesion property with a resin have been improved, and reducing manufacturing costs. |
