发明名称 |
MANUFACTURING METHOD AND DEVICE OF ELECTRONIC PART MOUNTING FILM CARRIER TAPE |
摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method of manufacturing an electronic part mounting film carrier tape, where a large number of solder ball connecting holes can be quickly and accurately bored in a base film tape so as to manufacture an electronic part mounting film carrier tape of high density and accuracy without using a punching die which is very expensive and requires a very long term to be manufactured. SOLUTION: A base film tape is moved by a pitch of electronic part mounting parts in a lengthwise direction and positioned, and an electronic part mounting part is formed on the base film tape. |
申请公布号 |
JP2001110853(A) |
申请公布日期 |
2001.04.20 |
申请号 |
JP20000196738 |
申请日期 |
2000.06.29 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
NISHIYAMA TOSHIHITO;AOKI TATSUYA |
分类号 |
H01L21/60;H01L23/00;H05K13/02 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|