发明名称 MANUFACTURING METHOD AND DEVICE OF ELECTRONIC PART MOUNTING FILM CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To provide a device and a method of manufacturing an electronic part mounting film carrier tape, where a large number of solder ball connecting holes can be quickly and accurately bored in a base film tape so as to manufacture an electronic part mounting film carrier tape of high density and accuracy without using a punching die which is very expensive and requires a very long term to be manufactured. SOLUTION: A base film tape is moved by a pitch of electronic part mounting parts in a lengthwise direction and positioned, and an electronic part mounting part is formed on the base film tape.
申请公布号 JP2001110853(A) 申请公布日期 2001.04.20
申请号 JP20000196738 申请日期 2000.06.29
申请人 MITSUI MINING & SMELTING CO LTD 发明人 NISHIYAMA TOSHIHITO;AOKI TATSUYA
分类号 H01L21/60;H01L23/00;H05K13/02 主分类号 H01L21/60
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