| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat pipe type cooler in which, when some semiconductor stacks are to be constituted, they can be arranged in such a way that interfer ence between an air suction side and an air discharging side of thermal radiating fins is avoided, and the number of heat pipes is increased without hindering air flow inside the thermal radiating fins to enable a cooling efficiency to be increased. SOLUTION: There is provided a heat pipe type cooler in which a plurality of heat pipes 2 extend from the upper surface of a heat receiving block 1, these heat pipes 2 may pass through many thermal radiating fins 3 overlapped to each other with some clearances being left in a vertical direction, and one side surface of the heat receiving block 1 becomes a fixing surface 1a for the items to be cooled. The heat pipes 2 are arranged in a plurality of rows along a direction of the cooled item fixing surface 1a of the heat receiving block 1.
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