发明名称 METHOD OF CUTTING RESIN SUBSTRATE OR RESIN FIBER AND MANUFACTURING METHOD OF LIQUID CRYSTAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting method of a resin substrate or resin fiber and a manufacturing method of a liquid crystal device which can prevent a liquid crystal display device from being deteriorated in characteristic and reliability and decreasing in manufacture yield owing to the deformation of a resin sub strate or resin fiber, the deformation and peeling of a transparent electrode film, etc., at in the cutting. SOLUTION: When a resin substrate 10 having an ITO transparent electrode film 12 formed is cut from its top surface side by using a cutter having a hard blade of <=30 deg. in included angle, umbrella-shaped projections are formed on the back surface side of the cut end surface 14 uniformly to a width of 0.3 to 2μm. This cut end surface 14 is thermally treated. Namely, the cut end surface 14 to back side edge part are made to abut against a flat surface of a glass plate or metal plate which is heated at 180 deg.C and are held for 5 to 10 seconds. Through this heat treatment, the umbrella-shaped projections of the resin substrate 10 which are formed from the cut end surface 14 to the back surface side are made smooth.
申请公布号 JP2001108838(A) 申请公布日期 2001.04.20
申请号 JP19990282006 申请日期 1999.10.01
申请人 SONY CORP 发明人 AKAO HIROTAKA;MATSUI ERIKO;TODA ATSUSHI
分类号 B26D7/27;G02B6/00;G02F1/13;G02F1/1333;G09F9/00;(IPC1-7):G02B6/00 主分类号 B26D7/27
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