Impedance-matched coplanar connection device, of tape automated bonding type, is used to connect microwave multi-chip modules together or onto printed circuits

摘要

Use of an impedance-matched coplanar connection device, formed by several connectors (2,3,4) on an insulating support (1), for connection of a microwave multi-chip module is new. Independent claims are also included for: (i) an assembly of a microwave multi-chip module connected onto a printed circuit by the above impedance-matched coplanar connection device; and (ii) an assembly of microwave multi-chip modules connected together by the above impedance-matched coplanar connection device.