| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste for a semiconductor, suitable for bonding a large-sized chip such as IC, etc., to a copper frame due to high bond strength in heating and excellent stress relaxation, capable of preventing defective characteristics of IC, etc., caused by chip crack, chip strain, etc., in an IC assembly process. SOLUTION: This resin paste for a semiconductor comprises a combination of two kinds of epoxy resins, a liquid phenol curing agent, a latent curing agent, a curing promoter being a tertiary amine salt and an inorganic filler. The epoxy resins are a liquid epoxy resin and an epoxy group-containing reactive diluent. This semiconductor device is produced by using the resin paste. |
