| 摘要 |
It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.
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