| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing excellent in electric insulation as before, short in sealing time, low in ionic impurities by using a liquid resin composition in sealing a semiconductor chip especially in area mounting sealing a semiconductor chip having a protruding anode on a circuit surface. SOLUTION: This liquid resin composition for sealing comprises a liquid epoxy resin, a compound having two or more phenolic hydroxy groups and an aromatic carboxylic acid in the molecule as a hardener and a hardening accelerator. A semiconductor device is produced by an area mounting method, coating the liquid resin composition for sealing, adjusting position of a circuit board and a semiconductor chip to make the anode electric contact with the circuit board, and then electrically contacting the protruding anode with the circuit board by heating and curing the resin. |
