| 摘要 |
PROBLEM TO BE SOLVED: To provide a gold plating method capable of obtaining a gold plating layer enabling the speeding-up of bonding, brazing and soldering and to provide a method for producing a wiring board. SOLUTION: By executing plating with an electrode in which the value of the minimum point in the superimposed current of DC and AC is zero, the grain size of gold to be precipitated is made large, and, uniform rocky ruggedness is formed on the plated surface. Then, by allowing the rocky ruggedness to hook at the edge parts of the wire to be bonded, brazing filler metals and solder materials, secure joining can be executed at a high speed.
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