METHOD FOR SELECTIVELY FORMING COPPER FILM

摘要

PURPOSE: A method for selectively forming copper film is provided to deposit copper selectively on the copper-film-formation requiring regions of an underlying film and to reduce the cost of the raw material of copper. CONSTITUTION: A method for selectively forming copper film consists of the first step of forming on the surface of the underlying film(22) provided on a substrate(21) the thin-film made of a silane coupling agent or an interfacial active agent, and the second step of projecting UV rays on the copper-film formation prearranging regions of the thin film to perform on these regions the CVDs of copper.