| 摘要 |
PURPOSE:To permit the measurement of ICs of different sizes with a chuck of the same chuck, by sticking a double-sided adhesive material on a measuring base and fixing an IC on the double-sided adhesive material to reduce the weight of the chuck. CONSTITUTION:A higher adhesive surface 1b of a double-sided adhesive material is stuck on a measuring base 3 and a measuring IC 4 is vacuum chucked on an IC mounting head 5a of a sticking unit 5. The measuring ICs are stuck on a less adhesive surface 1a of the double-sided adhesive 1 on the measuring base 3 except for a part 4a thereof. In this manner, a vibration is applied to the IC 4 fixed on the measuring base 3 to make a specified inspection. Upon completion of the inspection, a peeler 6 ejects a part 4a extruded toward the peeler 6 of the IC 4 and peels the IC 4 from the double-sided adhesive 1. The IC 4 peeled is mechanically chucked with an IC unloading head 7a of a recovery device 7 to be conveyed to a specified position.
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