| 摘要 |
PURPOSE: A method for processing metal material applicable to electronic parts, electronic parts and electro-optical parts, especially to liquid crystal display panels, various semiconductor devices, wiring boards, chip parts, and the like. CONSTITUTION: The metal material for electronic parts is characterized that it has lower resistivity, higher stability, and more excellent processability than the prior art. An applicable metal material is an alloy containing Ag as a main component, 0.1 to 3 wt% of Pd, and 0.1 to 3 wt% in total of elements such as Al. |
