SEMICONDUCTOR WAFER PROCESSOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer processor which can treat ultrathin semiconductor wafers without damaging. SOLUTION: Semiconductor wafers W stacked on a box 13A in a feed part 100 are taken out from the box 13A one by one by a take-out arm 103 and the taken-out wafers W are transferred to an alignment part 200 for positioning the wafers W by a mountable arm 501. After protective sheets pasted on the wafers W are separated from the wafers W in a separation part 300, the wafers W are transferred to a housing part 400. In the housing part 400, the wafers W and buffer sheets P2 are alternately housed in a box 13B of a carrier case by a transfer arm 401.