| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor chip on a substrate by the use of solder connection, having an improved quality and a device suitable therefor. SOLUTION: In order to package a semiconductor chip 1 on a substrate 1 having a solder portion 2, the semiconductor chip 1, supported by a gripping spring 5 mounted on a bonding head 4 is placed on the substrate 3, while the gripping spring 5 is shifted toward the bonding head 4. Next, the semiconductor chip 1 is moved up by a predetermined distance and is then released. The semiconductor chip 1 is arbitrarily moved vertically, before it is released. By this method, the semiconductor chip 1 is subjected to a mechanical control, until the solder portion is formed in a stable shape to position the semiconductor chip 1 at a final position. |
