| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which has no need for interrupting the polishing work for cleaning abrasives of a polisher. SOLUTION: An insulation resin layer 2 is provided on the surface of a wiring board 1 having surface layer circuits 4b, the surface of the insulation resin layer 2 is polished by abrasives 3 of a polisher, and circuits 9 are formed on the insulation resin layer 2 surface, thus manufacturing a multilayer wiring board. A region for not forming the insulation resin layer 2 is provided at least on one of the four corners of the wiring board 1, and a cleaner 5 is provided on this region for cleaning the surface of the abrasives 3 of the polisher by rubbing the abrasives 3. Thus, for every wiring board polished, it cleans the abrasives of the polisher, thus eliminating the need for interrupting the polishing work, the work efficiency can be held high and the insulation resin layer 2 can be roughened well by uniformizing the thickness of this layer 2. |
