发明名称 TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a temperature measuring device and a temperature measuring method capable of measuring, directly in a noncontact way with high accuracy, the temperature of a substrate whose temperature is actually required to be grasped. SOLUTION: This temperature measuring device 60 is equipped with fluorescent material 61 applied on the surface of a wafer W whose temperature is to be measured, a light source 62 for irradiating light onto the fluorescent material 61, a detecting circuit 66 for detecting residual light emitted from the fluorescent material 61 after shielding light from the light source 62, and a temperature measuring circuit 67 for calculating the attenuation rate of afterglow based on a detection result of the detecting circuit 66 and for determining the temperature of the substrate based thereon.
申请公布号 JP2001099722(A) 申请公布日期 2001.04.13
申请号 JP19990274611 申请日期 1999.09.28
申请人 TOKYO ELECTRON LTD 发明人 SHIRAKAWA HIDEKAZU;SATA NOBUYUKI
分类号 G01K11/12;(IPC1-7):G01K11/12 主分类号 G01K11/12
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